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IPC standard for soldering LPCC IC | |||
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Posted by: totoro ® 12/13/2006, 20:08:32 Author Profile eMail author Edit |
Does anybody know whether IPC standard spell out any spec regarding acceptable criteria of a tilted/lifted leadless chip carriers, are there any concern if a LPCC IC with center body ground tilted/not flush to the PCB ground pad? |
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Re: IPC standard for soldering LPCC IC | |||
Re: IPC standard for soldering LPCC IC -- totoro | Post Reply | Top of thread | Forum |
Posted by: Kelly Bramble ® 12/14/2006, 09:19:45 Author Profile eMail author Edit |
I don't have a copy of the IPC standard, however I do have MIL-STD-2000. My reference show that you are not allowed more or less than 15 degrees between the formed lead placement and the pad. I'm also showing that direct physical contact is required. Virtually all chip/component carriers seem to allow for some offsett, however no tilr beyonf 15 degrees. This the best I got... Are you bound to the IPC standard on this project/product? Modified by Kelly Bramble at Thu, Dec 14, 2006, 09:20:16 |
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Re: Re: IPC standard for soldering LPCC IC | |||
Re: Re: IPC standard for soldering LPCC IC -- Kelly Bramble | Post Reply | Top of thread | Forum |
Posted by: Kelly Bramble ® 12/14/2006, 09:28:21 Author Profile eMail author Edit |
Additional information: If you are mounting some sort of power amp or other device that needs to move heat energy, then no gap will be allowed between the thermal pad area and the device. There will also be minimum clearance rquirments between the thermal pad area and the solder mask. Ultimately, all of this is designed onto the PWB per your driving specification or your components recommended installation information. |
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Re: Re: Re: IPC standard for soldering LPCC IC | |||
Re: Re: Re: IPC standard for soldering LPCC IC -- Kelly Bramble | Post Reply | Top of thread | Forum |
Posted by: totoro ® 12/15/2006, 02:13:39 Author Profile eMail author Edit |
the LPCC device that is in concern is an amplifier IC, and heat dissipation and grounding is crucial. However, there is no valid standard to refer to, in order to reject the tilted IC with any visual acceptable standard. this is sometimes too hard to negotiate with suppliers who is strictly accept only the rejects which is not compliance to the IPC standard. |
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Re: Re: Re: Re: IPC standard for soldering LPCC IC | |||
Re: Re: Re: Re: IPC standard for soldering LPCC IC -- totoro | Post Reply | Top of thread | Forum |
Posted by: Kelly Bramble ® 12/16/2006, 08:11:26 Author Profile eMail author Edit |
The leadless chip carrier and amp IC manufacturer should installation design suggestions and requirements. Without a valid industry specification that how I would defend my design and installtion. |
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